ISTANBUL 2023
PROGRAM 2023
OUR EXPERTS
DUBAI 2022
CONTACT US
PARTICIPANT FORM
WELCOME TO THE ACAI CONFERENCE
10 - 14 JULY 2023
ISTANBUL
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Your Duties
Select the topic you are the most interested in
- Approximate Nearest Neighbor Search problem: history, variations, and modern techniques
- Graph Compiler for Ascend architecture
- Allocator The Great: Designing architecture-aware memory allocator
- Different aspects of lock-based concurrent data structures
- Efficient Methodology and Tools for performance estimation in microArch features development
- Analyzing load-balancing issues for MPI applications via scalable Critical Path Analysis
- Several approaches for efficient supercomputer management
- Automatic detection of deadlocks in MPI applications
- Heterogeneous memory systems: data placement and homomorphically encrypted deep learning inference
- OpenSource Chip design&verification tools
- Open source tools for chip backend design
- Topos theory application in AI
- All The Ways You May Compress Neural Networks
- AI Training accelerators for Data-Centers – Past present and challenges of future systems
- Efficient Large Language Model (LLM) Inference
- Generalization of Neural Networks to Hypercomplex Numbers of the Second Order
- Resolve performance bottlenecks using Hierarchical Roofline model on CPUs
- Cache-aware Roofline model
- Roofline analysis and its application to Locally Recursive non-Locally Asynchronous (LRnLA) algorithms construction
- Physics-informed machine learning for accelerating simulation of physical processes
- Pre- and post-processing for our brand-new Inference Engine: overview and challenges
- Ways to optimize neural network accuracy: current approaches, those weaknesses and strong sides
- k-means clustering algorithm optimization with pruning strategies for distributed environment
- Distributed Leiden algorithm on Spark
- XGBoost optimizations
- Kunpeng Math Library mixed-precision solvers for dense linear algebra
- Directive-based parallel programming for heterogeneous clusters: experience and opportunities
- Jet/spay cooling of high-power microelectronics at dielectric liquid boiling. Results and perspectives
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TECHNOLOGIES FOR INNOVATORS. LET’S CREATE THE FUTURE TOGETHER
acai.conference@gmail.com
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